Open Access Journal

ISSN : 2394 - 6849 (Online)

International Journal of Engineering Research in Electronics and Communication Engineering(IJERECE)

Monthly Journal for Electronics and Communication Engineering

Open Access Journal

International Journal of Engineering Research in Electronics and Communication Engineering(IJERECE)

Monthly Journal for Electronics and Communication Engineering

ISSN : 2394-6849 (Online)

Reference :

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    [2]A. Naeemi and J. D. Meindl, “Compact physics-based circuit models for graphene nanoribbon interconnects,” IEEE Transaction on Electron Devices, vol. 56, no. 9, pp. 1822–1833, 2009.

    [3]X. Chen, C. Liao, and S. Hu, “An Interconnect Reliability-Driven Routing Technique for Electro migration Failure Avoidance,” IEEE Trans. Depend. and Secure Comp. vol. 9, no.5, pp. 770–776, Sept. 2012.

    [4]J. Pak, S. K. Lim, and D. Z. Pan, “Electro migration study for multiscalepower/ground vias in TSV-based 3D ICs,” in Proc. IEEE Int. Conf.Comp.-Aided Des., San Jose, CA, USA, 2013, pp. 379–386.

    [5] X. Zhao, Y. Wan, M. Scheuermann, and S. K. Lim, “Transient modeling of Electro migration and lifetime analysis of power distribution network for 3D ICs,” in Proc. IEEE Int. Conf. Comp.-Aided Des., San Jose, CA, USA, 2013, pp. 363–370.

    [6]J. Cong, “An interconnect-centric design flow for nanometer technologies,” in Proc. IEEE, 2001, vol 89, pp. 487-480.

    [7]] Understand and Avoid Electro migration (EM) & IRdrop in Custom IP Blocks.Published: 2011, Solvnet. http://www.synopsys.com/Tools/Verification/CapsuleModu le/CustomSim-RA-wp.pdf

    [8]] Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits – Roy, K http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=118 2065&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel5% 2F5%2F26532%2F01182065


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